Single-phase immersion cooling system and method of the same

ABSTRACT

A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, at least a second conduit, stand, and at least a propulsion-like apparatus. The at least a first and second conduits have first and second modifiable portions comprising first and second openings. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel generating at least a first flow channel for directing a first flow of the dielectric thermally conductive fluid. The at least a propulsion-like apparatus moves the dielectric thermally conductive fluid from one face to an opposite face in the same direction as the first flow, supplementing and enhancing circulation within the fluid-tight containment vessel.

RELATED APPLICATIONS

This application is a continuation-in-part of U.S. nonprovisional patentapplication Ser. No. 17/146,517, filed Jan. 12, 2021, the contents ofwhich are incorporated herein by reference as if fully disclosed herein.

TECHNICAL FIELD

Embodiments described herein relate generally to the field of heattransfer and, more particularly, to single-phase immersion coolingsystems and methods for cooling electronic devices via circulating fluidin a fluid-tight containment vessel.

BACKGROUND

During operation of electric and electronic elements, devices andsystems, the heat generated thereby, for example, by CPUs, processingunits, or graphic boards, must be dissipated quickly and efficiently tokeep operating temperature within manufacturer recommended ranges,under, at times, challenging operating conditions. As these elements,devices and systems increase in functionality and applicability, so doesthe power requirements thereof, and this in turn increases coolingrequirements.

Several techniques have been developed for extracting heat from electricand electronic elements, devices and systems. One such technique is aliquid-cooling system, wherein a heat exchanger is in thermal contactwith the elements, devices and/or systems, transporting heat awaytherefrom, and then cooling fluid, circulating within a cooling loopsystem incorporating the heat exchanger, flows over the heat exchangerby a pumping unit, removing heat therefrom. Heat is transferred from theheat source to the heat exchanger, the heat exchanger to the coolingfluid, and the cooling fluid to the environment by a radiator.

Generally, a maximum operating temperature of electric and electronicelements, devices and systems is defined and an appropriateliquid-cooling system dependent on a heat exchanger, radiator, and pumpefficiency is provided. However, as operating temperatures increase sodo costs, total installation time, risks for leakage, loss of parts, andtotal area requirements for the liquid-cooling systems. The increasedcosts, total installation time, risks for leakage, loss of parts, andtotal area requirements for the liquid-cooling systems are exacerbatedwhen dispositions of the operating temperatures within the electric andelectronic systems change.

SUMMARY

In an embodiment, a single-phase immersion cooling system, comprising afluid-tight containment vessel, a dielectric thermally conductive fluid,at least a heat-generating electronic device, and a heat exchangersystem is provided. The dielectric thermally conductive fluid iscontained within the fluid-tight containment vessel and the at least aheat-generating electronic device is submerged within the dielectricthermally conductive fluid. The heat exchanger system comprises a pump,a heat exchanger, at least a first conduit, at least a second conduit, astand, and at least a propulsion-like apparatus. The heat exchanger hasa heat exchanger inlet and a heat exchanger outlet. The at least a firstconduit has a first modifiable portion comprising a first openingsubmerged within the dielectric thermally conductive fluid. The at leasta second conduit has a second modifiable portion comprising a secondopening submerged within the dielectric thermally conductive fluid.

At least one of the at least a first conduit or second conduitcirculates dielectric thermally conductive fluid from the heat exchangeroutlet into the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel and the other of the first conduit orsecond conduit circulates dielectric thermally conductive fluidcontained within the fluid-tight containment vessel thereout to the heatexchanger inlet via the pump. The first and second openings are disposednear to greatest opposing ends of the dielectric thermally conductivefluid contained within the fluid-tight containment vessel. The at leasta propulsion-like apparatus is configured to supplement and enhance thecirculation of dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel.

In certain embodiments, the disposition of the first and second openingsgenerate at least a first flow channel for directing a first flow of thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel.

In certain embodiments, the at least a propulsion-like apparatus isdisposed between the first and second openings supplementing andenhancing the circulation of dielectric thermally conductive fluidcontained within the fluid-tight containment vessel.

In certain embodiments, the at least a propulsion-like apparatusconverts rotational movement to thrust to move dielectric thermallyconductive fluid from one face of the at least a propulsion-likeapparatus to an opposite face of the at least a propulsion-likeapparatus. The direction of the at least a first flow channel fordirecting the first flow of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel is the same as thedirection of thrust moving dielectric thermally conductive fluid fromone face of the at least a propulsion-like apparatus to the oppositeface of the at least a propulsion-like apparatus.

The single-phase immersion cooling system efficiently cools the at leasta heat-generating electronic device, as an example, such asheat-generating electric and/or electronic elements, devices and/orsystems, decreasing a requirement for and/or requirement for an amountof cooling components, as an example, such as interface materials, heatsinks, heat sink fins, and fans etc., for cooling thereof, decreasingcosts, total installation time, and total area requirements.

In some embodiments, the fluid-tight containment vessel comprises acontainment vessel having a vessel opening and a containment coverconfigured to fluid-tight mount to the vessel opening. The dielectricthermally conductive fluid, at least a heat-generating electronicdevice, and first and second openings are contained within thefluid-tight containment vessel via the vessel opening.

The fluid-tight containment vessel comprising the containment vesselhaving the vessel opening and the containment cover configured tofluid-tight mount to the vessel opening, easily and simply provideaccess to a user for filling of the dielectric thermally conductivefluid, decreasing total installation time.

The single-phase immersion cooling system decreases risks for leakage asrisks for a liquid-cooling system having a heat exchanger in thermalcontact with the electric and/or electronic elements, devices and/orsystems, transporting heat away therefrom are greater, due to leakagealong any one of conduits, mounting portions, and heat exchangers of theliquid-cooling system causing damage to the non-submersible electricand/or electronic elements, devices and/or systems. The fluid-tightcontainment vessel also prevents contact of the heat-generating electricand/or electronic elements, devices and/or systems during operation withthe surrounding environment, decreasing damage due to high temperature,high humidity, oily or dusty air, and/or salty coastal areaenvironments.

In some embodiments, the single-phase immersion cooling system furthercomprises at least a fluid-tight first conduit access entrance and atleast a fluid-tight second conduit access entrance. The at least afluid-tight first conduit access entrance is through the fluid-tightcontainment vessel and is configured to provide at least the firstconduit from an exterior of the fluid-tight containment vessel to aninterior of the fluid-tight containment vessel for access to thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel. The at least a fluid-tight second conduit accessentrance is through the fluid-tight containment vessel and configured toprovide at least the second conduit from an exterior of the fluid-tightcontainment vessel to an interior of the fluid-tight containment vesselfor access to the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel.

In some embodiments, the at least a heat-generating electronic devicecomprises at least one of a motherboard, printed circuit board, centralprocessing unit, graphics processing unit, memory, storage device, orlighting, or any combination of the foregoing.

In some embodiments, the single-phase immersion cooling system furthercomprises at least a fluid-tight cable access entrance through thefluid-tight containment vessel. The at least a fluid-tight cable accessentrance is configured to provide at least one of a control cable, datacable, communications cable, or signal cable, or any combination of theforegoing, from an exterior of the fluid-tight containment vessel to aninterior of the fluid-tight containment vessel for further access to theat least a heat-generating electronic device.

In some embodiments, the single-phase immersion cooling system furthercomprises a power supply unit submerged within the dielectric thermallyconductive fluid. The power supply unit is configured to provide powerto the at least a heat-generating electronic device, wherein the atleast a fluid-tight cable access entrance through the fluid-tightcontainment vessel is further configured to provide at least a powercable from an exterior of the fluid-tight containment vessel to aninterior of the fluid-tight containment vessel for further access to thepower supply unit.

The fluid-tight cable and conduit access entrances provides easy andsimple mounting and access to a user for control cables, data cables,communications cables, signal cables, and/or power cables, from theexterior of the fluid-tight containment vessel to the interior of thefluid-tight containment vessel for access to the at least aheat-generating electronic device and/or power supply unit,respectively.

In some embodiments, the single-phase immersion cooling system furthercomprises a removable bracket structure disposed and mounted within thefluid-tight containment vessel, configured for mounting of the powersupply unit and the at least a heat-generating electronic devicethereto.

The removable bracket structure disposed and mounted within thefluid-tight containment vessel, configured for mounting of theheat-generating electric and/or electronic elements, devices and/orsystems thereto, easily and simply provide access to a user for mountingof the heat-generating electric and/or electronic elements, devicesand/or systems, decreasing total installation time.

In certain embodiments, the single-phase immersion cooling systemfurther comprises at least a first conduit having a third modifiableportion and at least a second conduit having a fourth modifiableportion. The third modifiable portion comprises a third openingsubmerged within the dielectric thermally conductive fluid and thefourth modifiable portion comprises a fourth opening submerged withinthe dielectric thermally conductive fluid. The first modifiable portionis dismounted from the at least a first conduit and the third modifiableportion is mounted to the at least a first conduit and the secondmodifiable portion is dismounted from the at least a second conduit andthe fourth modifiable portion is mounted to the at least a secondconduit. At least one of the first conduit or second conduit circulatesdielectric thermally conductive fluid from the heat exchanger outletinto the dielectric thermally conductive fluid contained within thefluid-tight containment vessel and the other of the first conduit orsecond conduit circulates dielectric thermally conductive fluidcontained within the fluid-tight containment vessel thereout to the heatexchanger inlet via the pump. The third and fourth openings are disposednear to greatest opposing ends of the dielectric thermally conductivefluid contained within the fluid-tight containment vessel which aredifferent from that of the disposition of the first and second openings.The lengths and shapes of the first and third modifiable portions andlengths and shapes of the second and fourth modifiable portions aredifferent, respectively, and the disposition of the third and fourthopenings generate at least a third flow channel, different from thefirst flow channel, for directing a third flow of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel. The at least a propulsion-like apparatus is disposed between thefirst and second openings supplementing and enhancing the circulation ofdielectric thermally conductive fluid contained within the fluid-tightcontainment vessel.

In certain embodiments, the single-phase immersion cooling systemfurther comprises at least a first conduit having a fifth modifiableportion and at least a second conduit having a fourth modifiableportion. The fifth modifiable portion comprises a fifth openingsubmerged within the dielectric thermally conductive fluid and thefourth modifiable portion comprises a fourth opening submerged withinthe dielectric thermally conductive fluid. The first modifiable portionis dismounted from the at least a first conduit and the fifth modifiableportion is mounted to the at least a first conduit and the secondmodifiable portion is dismounted from the at least a second conduit andthe fourth modifiable portion is mounted to the at least a secondconduit. At least one of the first conduit or second conduit circulatesdielectric thermally conductive fluid from the heat exchanger outletinto the dielectric thermally conductive fluid contained within thefluid-tight containment vessel and the other of the first conduit orsecond conduit circulates dielectric thermally conductive fluidcontained within the fluid-tight containment vessel thereout to the heatexchanger inlet via the pump. The fifth and fourth openings are disposednear to greatest opposing ends of the dielectric thermally conductivefluid contained within the fluid-tight containment vessel which aredifferent from that of the disposition of the first and second openings.The lengths and shapes of the first and fifth modifiable portions andlengths and shapes of the second and fourth modifiable portions aredifferent, respectively, and the disposition of the fifth and fourthopenings generate at least a fifth flow channel, different from thefirst flow channel, for directing a fifth flow of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel. The at least a propulsion-like apparatus is disposed between thefirst and second openings supplementing and enhancing the circulation ofdielectric thermally conductive fluid contained within the fluid-tightcontainment vessel.

In certain embodiments, the pump of the single-phase immersion coolingsystem is submerged within the dielectric thermally conductive fluidwithin the fluid-tight containment vessel. In certain embodiments, thepump of the single-phase immersion cooling system is mounted to an outerside of the fluid-tight containment vessel.

In certain embodiments, the heat exchanger of the single-phase immersioncooling system comprises a heat exchanger radiator, mounted to an outerside of the fluid-tight containment vessel. In certain embodiments, theheat exchanger of the single-phase immersion cooling system furthercomprises at least a fan unit mounted to the heat exchanger radiator,opposite to the outer side of the fluid-tight containment vessel. Incertain embodiments, the heat exchanger radiator of the single-phaseimmersion cooling system comprises at least a built-in fluid tankreservoir having a reservoir opening, whereby dielectric thermallyconductive fluid is added into the built-in fluid tank reservoir.

In some embodiments, the dielectric thermally conductive fluid of thesingle-phase immersion cooling system comprises a single-phase fluid. Insome embodiments, the fluid-tight containment vessel of the single-phaseimmersion cooling system comprises at least one of a metal, plastic, ortransparent plastic material, or any combination of the foregoing.

In an embodiment, a single-phase immersion cooling method, comprisingproviding a single-phase immersion cooling system and circulating adielectric thermally conductive fluid therewithin is provided. Thesingle-phase immersion cooling method comprises providing thesingle-phase immersion cooling system including providing a fluid-tightcontainment vessel, providing a dielectric thermally conductive fluidcontained within the fluid-tight containment vessel, providing at leasta heat-generating electronic device submerged within the dielectricthermally conductive fluid, and providing a heat exchanger system. Theheat exchanger system of the method comprises a pump, a heat exchangerhaving a heat exchanger inlet and a heat exchanger outlet, at least afirst conduit having a first modifiable portion comprising a firstopening submerged within the dielectric thermally conductive fluid, atleast a second conduit having a second modifiable portion comprising asecond opening submerged within the dielectric thermally conductivefluid a stand, and at least a propulsion-like apparatus mounted to thestand. The method further comprises circulating, via the pump, andsupplementing and enhancing via the at least a propulsion-likeapparatus, dielectric thermally conductive fluid from the heat exchangeroutlet into the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel through at least one of the firstconduit or second conduit and circulating, via the pump, dielectricthermally conductive fluid contained within the fluid-tight containmentvessel thereout to the heat exchanger inlet through the other of thefirst conduit or second conduit. The first and second openings of themethod are disposed near to greatest opposing ends of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel. The at least a propulsion-like apparatus supplements andenhances the circulation of dielectric thermally conductive fluidcontained within the fluid-tight containment vessel.

In certain embodiments of the method, the method further comprisesgenerating at least a first flow channel for directing a first flow ofthe dielectric thermally conductive fluid contained within thefluid-tight containment vessel via the disposition of the first andsecond openings.

In certain embodiments of the method, the method further comprisesproviding at least a first conduit having a third modifiable portioncomprising a third opening submerged within the dielectric thermallyconductive fluid and providing at least a second conduit having a fourthmodifiable portion comprising a fourth opening submerged within thedielectric thermally conductive fluid. The method further comprisesdismounting the first modifiable portion from the at least a firstconduit and mounting the third modifiable portion to the at least afirst conduit and dismounting the second modifiable portion from the atleast a second conduit and mounting the fourth modifiable portion to theat least a second conduit. Also, the method further comprisescirculating, via the pump, dielectric thermally conductive fluid fromthe heat exchanger outlet into the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel through at least oneof the first conduit or second conduit and circulating, via the pump,dielectric thermally conductive fluid contained within the fluid-tightcontainment vessel thereout to the heat exchanger inlet through theother of the first conduit or second conduit. The single-phase immersioncooling method further comprises generating at least a third flowchannel for directing a third flow of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel viathe disposition of the third and fourth openings. The third and fourthopenings of the single-phase immersion cooling method are disposed nearto greatest opposing ends of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel which are differentfrom that of the disposition of the first and second openings, wherebythe lengths and shapes of the first and third modifiable portions andlengths and shapes of the second and fourth modifiable portions aredifferent, respectively.

In certain embodiments of the method, the method further comprisesproviding at least a first conduit having a fifth modifiable portioncomprising a fifth opening submerged within the dielectric thermallyconductive fluid and providing at least a second conduit having a fourthmodifiable portion comprising a fourth opening submerged within thedielectric thermally conductive fluid. The method further comprisesdismounting the first modifiable portion from the at least a firstconduit and mounting the fifth modifiable portion to the at least afirst conduit and dismounting the second modifiable portion from the atleast a second conduit and mounting the fourth modifiable portion to theat least a second conduit. Also, the method further comprisescirculating, via the pump, dielectric thermally conductive fluid fromthe heat exchanger outlet into the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel through at least oneof the first conduit or second conduit and circulating, via the pump,dielectric thermally conductive fluid contained within the fluid-tightcontainment vessel thereout to the heat exchanger inlet through theother of the first conduit or second conduit. The single-phase immersioncooling method further comprises generating at least a fifth flowchannel for directing a fifth flow of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel viathe disposition of the fifth and fourth openings. The fifth and fourthopenings of the single-phase immersion cooling method are disposed nearto greatest opposing ends of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel which are differentfrom that of the disposition of the first and second openings, wherebythe lengths and shapes of the first and fifth modifiable portions andlengths and shapes of the second and fourth modifiable portions aredifferent, respectively.

The modifiable portions of the at least a first and second conduits,having different and/or same lengths and different and/or same shapes,in any combination, easily and conveniently allow users to exchange aninsurmountable amount of modifiable portions, each having openings, ofthe heat exchanger system, to form an insurmountable amount of differentflow channels for directing a flow of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel viathe disposition of the openings. The increased costs, total installationtime, risks for leakage, loss of parts, and total area requirements forthe single-phase immersion cooling system are not exacerbated whendispositions of the operating temperatures within the electric and/orelectronic elements, devices and/or systems change, as easy and simpledismounting and mounting of appropriate modifiable portions easily andsimply adjust the flow of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel via the dispositionof the openings for a most optimal transfer of heat.

BRIEF DESCRIPTION OF THE DRAWINGS

Unless specified otherwise, the accompanying drawings illustrate aspectsof the innovative subject matter described herein. Referring to thedrawings, wherein like reference numerals indicate similar partsthroughout the several views, several examples of heat exchanger systemsincorporating aspects of the presently disclosed principles areillustrated by way of example, and not by way of limitation.

FIG. 1A depicts a representation of an embodiment of a single-phaseimmersion cooling system.

FIG. 1B depicts a representation of the embodiment of the single-phaseimmersion cooling system of FIG. 1A.

FIG. 2A depicts a representation of an embodiment of a single-phaseimmersion cooling system without a containment cover.

FIG. 2B depicts a cross-sectional view of the embodiment of thesingle-phase immersion cooling system along line A-A of FIG. 2A.

FIG. 3A depicts a representation of an embodiment of a single-phaseimmersion cooling system without a containment cover.

FIG. 3B depicts a cross-sectional view of the embodiment of thesingle-phase immersion cooling system along line B-B of FIG. 3A.

FIG. 4 depicts a representation of an embodiment of conduits, a pump, apower supply unit, a motherboard and a printed circuit board.

FIG. 5 depicts a representation of an embodiment of conduits, a pump, apower supply unit and a printed circuit board.

FIG. 6 depicts a representation of an embodiment of conduits, a pump,and a power supply unit.

FIG. 7A depicts a representation of an embodiment of a pump.

FIG. 7B depicts a cross-sectional view of the embodiment of the pumpalong line C-C of FIG. 7A.

FIG. 8 depicts a representation of an embodiment of conduits, a pump, apower supply unit, a printed circuit board and a propulsion-likeapparatus.

FIG. 9 depicts a representation of an embodiment of a single-phaseimmersion cooling system without a heat exchanger and at least a fanunit.

FIG. 10 depicts a cross-sectional view of an embodiment of the conduitsof a single-phase immersion cooling system.

FIG. 11 depicts a cross-sectional view of an alternative embodiment of asingle-phase immersion cooling system.

FIG. 12 depicts a cross-sectional view of the alternative embodiment ofFIG. 11 from an opposing side.

FIG. 13 depicts a representation of an alternative embodiment ofconduits, a pump, a power supply unit, a motherboard and a printedcircuit board.

FIG. 14 depicts a representation of an alternative embodiment ofconduits, a pump, a power supply unit and a printed circuit board.

FIG. 15 depicts a representation of an alternative embodiment ofconduits, a pump, and a power supply unit.

FIG. 16 depicts a representation of another embodiment of conduits, apump, a power supply unit, a printed circuit board and a propulsion-likeapparatus.

FIG. 17 depicts a representation of another alternative embodiment of asingle-phase immersion cooling system.

FIG. 18A depicts a representation of an inner panel of the anotheralternative embodiment of a single-phase immersion cooling system ofFIG. 17.

FIG. 18B depicts a plane view of the inner panel of the anotheralternative embodiment of a single-phase immersion cooling system FIG.18A.

DETAILED DESCRIPTION

The following describes various principles related to single-phaseimmersion cooling systems and methods by way of reference to specificexamples of fluid-tight containment vessels, dielectric thermallyconductive fluids, heat-generating electronic devices, and heatexchanger systems, including specific arrangements and examples ofvessels, fluids, pumps, radiators, propulsion-like apparatuses, andconduits having modifiable portions, each comprising openings, embodyinginnovative concepts. More particularly, but not exclusively, suchinnovative principles are described in relation to selected examples ofvessels, fluids, pumps, radiators, propulsion-like apparatuses, andconduits having modifiable portions, each comprising openings andwell-known functions or constructions are not described in detail forpurposes of succinctness and clarity. Nonetheless, one or more of thedisclosed principles can be incorporated in various other embodiments ofvessels, fluids, pumps, radiators, propulsion-like apparatuses, andconduits having modifiable portions, each comprising openings to achieveany of a variety of desired outcomes, characteristics, and/orperformance criteria.

Thus, vessels, fluids, pumps, radiators, propulsion-like apparatuses,and conduits having modifiable portions, each comprising openings havingattributes that are different from those specific examples discussedherein can embody one or more of the innovative principles, and can beused in applications not described herein in detail. Accordingly,embodiments of vessels, fluids, pumps, radiators, propulsion-likeapparatuses, and conduits having modifiable portions, each comprisingopenings not described herein in detail also fall within the scope ofthis disclosure, as will be appreciated by those of ordinary skill inthe relevant art following a review of this disclosure.

Example embodiments as disclosed herein are directed to single-phaseimmersion cooling systems and methods of the same, wherein a heatexchanger system circulates non-heated dielectric thermally conductivefluid from a heat exchanger outlet into a dielectric thermallyconductive fluid contained within a fluid-tight containment vessel andcirculates heated dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel thereout to a heat exchanger inletthrough conduits, respectively, via a pump, supplemented and enhanced bya propulsion-like apparatus, efficiently cooling heat-generatingelectric and/or electronic elements, devices and/or systems submergedwithin the dielectric thermally conductive fluid. The dielectricthermally conductive fluid is in direct thermal contact with theelectric and/or electronic elements, devices and/or systems, and a flowchannel for directing a flow of the non-heated and heated dielectricthermally conductive fluid contained within the fluid-tight containmentvessel is generated for heat transfer. The flow channel is modified byusers, depending upon the disposition and amount of heat generated fromthe electric and/or electronic elements, devices and/or systems forefficacy, via different and/or same lengths and different and/or sameshapes of modifiable portions of the conduits.

In an embodiment, a single-phase immersion cooling system, comprising afluid-tight containment vessel, dielectric thermally conductive fluid,at least a heat-generating electronic device, and heat exchanger systemis provided. The heat exchanger system comprises a pump, heat exchanger,at least a first conduit, at least a second conduit, a stand, and atleast a propulsion-like apparatus. The at least a first and secondconduits have first and second modifiable portions comprising first andsecond openings submerged within the dielectric thermally conductivefluid, respectively. At least one of the at least a first conduit orsecond conduit circulates dielectric thermally conductive fluid from aheat exchanger outlet into the fluid-tight containment vessel and theother of the first conduit or second conduit circulates dielectricthermally conductive fluid from the fluid-tight containment vessel to aheat exchanger inlet via the pump. The first and second openings aredisposed near to greatest opposing ends of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel.

In an embodiment, a single-phase immersion cooling system 100,comprising a fluid-tight containment vessel 190, 199, a dielectricthermally conductive fluid (not shown), at least a heat-generatingelectronic device 150, 155, and a heat exchanger system is provided.FIG. 1A depicts a representation of an embodiment of a single-phaseimmersion cooling system. FIG. 1B depicts a representation of theembodiment of the single-phase immersion cooling system of FIG. 1A.

FIG. 2A depicts a representation of an embodiment of a single-phaseimmersion cooling system without a containment cover. FIG. 2B depicts across-sectional view of the embodiment of the single-phase immersioncooling system along line A-A of FIG. 2A. FIG. 3A depicts arepresentation of an embodiment of a single-phase immersion coolingsystem without a containment cover. FIG. 3B depicts a cross-sectionalview of the embodiment of the single-phase immersion cooling systemalong line B-B of FIG. 3A. FIG. 4 depicts a representation of anembodiment of conduits, a pump, a power supply unit, a motherboard and aprinted circuit board. FIG. 5 depicts a representation of an embodimentof conduits, a pump, a power supply unit and a printed circuit board.FIG. 6 depicts a representation of an embodiment of conduits, a pump,and a power supply unit. Referring to FIGS. 1A to 6, the dielectricthermally conductive fluid (not shown) is contained within thefluid-tight containment vessel 190, 199 and the at least aheat-generating electronic device 150, 155 is submerged within thedielectric thermally conductive fluid. The heat exchanger systemcomprises a pump 130, a heat exchanger 170, at least a first conduit110, and at least a second conduit 120. The heat exchanger 170 has aheat exchanger inlet and a heat exchanger outlet. The at least a firstconduit 110 has a first modifiable portion 115 comprising a firstopening 119 submerged within the dielectric thermally conductive fluid.The at least a second conduit 120 has a second modifiable portion 125comprising a second opening 129 submerged within the dielectricthermally conductive fluid.

At least one of the at least a first conduit 110 or second conduit 120circulates dielectric thermally conductive fluid from the heat exchangeroutlet into the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 and the other of the firstconduit 110 or second conduit 120 circulates dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199 thereout to the heat exchanger inlet via the pump 130. Thefirst and second opening 119, 129 are disposed near to greatest opposingends of the dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199.

FIG. 7A depicts a representation of an embodiment of a pump. FIG. 7Bdepicts a cross-sectional view of the embodiment of the pump along lineC-C of FIG. 7A. Referring to FIGS. 7A and 7B, and referring to FIGS. 1Ato 6, it is readily appreciated that any suitable type, style, size, andamount of pump 130 may be implemented by those of ordinary skill in therelevant art within the single-phase immersion cooling system 100 andthe embodiments are not limited thereto. As long as dielectric thermallyconductive fluid is circulated from an outlet of the heat exchangerradiator 170 into the dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel 190, 199 through a conduit110, 120, and dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199 is circulated thereout to aninlet of the heat exchanger radiator 170 through an other conduit 110,120, via the pump 130, efficiently cooling the heat-generating electricand/or electronic elements, devices and/or systems, submerged within thedielectric thermally conductive fluid.

In certain embodiments, the disposition of the first and second opening119, 129 generate at least a first flow channel for directing a firstflow of the dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199.

The single-phase immersion cooling system 100 efficiently cools the atleast a heat-generating electronic device 150, 155, as an example, suchas heat-generating electric and/or electronic elements, devices and/orsystems, decreasing a requirement for and/or requirement for an amountof cooling components, as an example, such as interface materials, heatsinks, heat sink fins, and fans etc., for cooling thereof, decreasingcosts, total installation time, and total area requirements.

It is readily appreciated that any suitable type, style, size, length,material and amount of conduit 110, 120 may be implemented by those ofordinary skill in the relevant art within the single-phase immersioncooling system 100 and the embodiments are not limited thereto. Examplesof conduit materials comprise fixed shaped galvanized steel, PVC andpolyethylene etc. As long as the first and second opening 119, 129generate at least a steady flow channel for directing a steady flow ofthe dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199.

In certain embodiments, the pump 130 of the single-phase immersioncooling system 100, together with the disposition of the first andsecond opening 119, 129, generate at least a first flow channel fordirecting a first flow of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel 190, 199, however,the embodiments are not limited thereto. Those having ordinary skill inthe relevant art may readily appreciate that apparatuses and devicesthat supplement and enhance the at least a first flow channel fordirecting the first flow of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel 190, 199, may alsobe implemented in the embodiments.

FIG. 8 depicts a representation of an embodiment of conduits, a pump, apower supply unit, a printed circuit board and a propulsion-likeapparatus. Referring to FIG. 8, and referring to FIGS. 1A-7B, thesingle-phase immersion cooling system 100 of FIGS. 1A-7B may be similarin some respects to the single-phase immersion cooling system of FIG. 8,and thus may be best understood with reference thereto where likenumerals designate like components not described again in detail. Unlikethe single-phase immersion cooling system 100 of FIGS. 1A-7B, thesingle-phase immersion cooling system of FIG. 8 further comprises atleast a propulsion-like apparatus 135 and a mount or stand 139. The atleast a propulsion-like apparatus 135 is configured to supplement andenhance the at least a first flow channel for directing the first flowof the dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199 generated by the pump 130,together with the disposition of the first and second opening 119, 129.The at least a propulsion-like apparatus 135 is mounted to the mount orstand 139.

In certain embodiments, dielectric thermally conductive fluid (notshown) is contained within the fluid-tight containment vessel 190, 199and the at least a heat-generating electronic device 150, 155 issubmerged within the dielectric thermally conductive fluid. The heatexchanger system comprises the pump 130, the heat exchanger 170, the atleast a first conduit 110, the at least a second conduit 120, the atleast a propulsion-like apparatus 135 and a mount or stand 139. The heatexchanger 170 has a heat exchanger inlet and a heat exchanger outlet.The at least a first conduit 110 has a first modifiable portion 115comprising a first opening 119 submerged within the dielectric thermallyconductive fluid. The at least a second conduit 120 has a secondmodifiable portion 125 comprising a second opening 129 submerged withinthe dielectric thermally conductive fluid. The at least apropulsion-like apparatus 135 comprises at least a propeller, a motor,and a frame. The propeller is electrically connected to the motor. Thepropeller and motor are mounted to the frame. The at least apropulsion-like apparatus 135 is configured to convert rotationalmovement to thrust to move dielectric thermally conductive fluid fromone face of the at least a propulsion-like apparatus 135 to an oppositeface of the at least a propulsion-like apparatus 135. Thus, the at leasta propulsion-like apparatus 135 supplements and enhances the at least afirst flow channel for directing the first flow of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 generated by the pump 130, together with the dispositionof the first and second opening 119, 129. The mount or stand 139 isdisposed next to the pump 130 and comprise at least two openings 138.The at least a second conduit 120 and the second opening 129 at leastpartially extends through at least one of the at least two openings 138undisturbed.

In certain embodiments, at least one of the at least a first conduit 110or second conduit 120 circulates dielectric thermally conductive fluidfrom the heat exchanger outlet into the dielectric thermally conductivefluid contained within the fluid-tight containment vessel 190, 199 andthe other of the first conduit 110 or second conduit 120 circulatesdielectric thermally conductive fluid contained within the fluid-tightcontainment vessel 190, 199 thereout to the heat exchanger inlet via thepump 130. The first and second opening 119, 129 are disposed near togreatest opposing ends of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel 190, 199. The atleast a propulsion-like apparatus 135 is positioned between the firstand second opening 119, 129. The direction of thrust to move dielectricthermally conductive fluid from one face of the at least apropulsion-like apparatus 135 to an opposite face of the at least apropulsion-like apparatus 135 is dependent on which of at least one ofthe at least a first conduit 110 or second conduit 120 circulatesdielectric thermally conductive fluid from the heat exchanger outletinto the dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199 and which one of the other ofthe first conduit 110 or second conduit 120 circulates dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 thereout to the heat exchanger inlet via the pump 130.The general direction of the at least a first flow channel for directingthe first flow of the dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel 190, 199 generated by the pump130, together with the disposition of the first and second opening 119,129 circulating dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 is the same as the directionof thrust moving liquid from one face of the at least a propulsion-likeapparatus 135 to the opposite face of the at least a propulsion-likeapparatus 135.

It is readily appreciated that any suitable type, style, size, andamount of the at least a propulsion-like apparatus 135 configured forunderwater and immersible usage, for different capacities (flow rate),and of various non-rust materials, may be implemented by those ofordinary skill in the relevant art within the single-phase immersioncooling system 100 and the embodiments are not limited thereto. As longas dielectric thermally conductive fluid is circulated from an outlet ofthe heat exchanger radiator 170 into the dielectric thermally conductivefluid contained within the fluid-tight containment vessel 190, 199through a conduit 110, 120, and dielectric thermally conductive fluidcontained within the fluid-tight containment vessel 190, 199 iscirculated thereout to an inlet of the heat exchanger radiator 170through an other conduit 110, 120, via the pump 130, and is supplementedand enhanced by the at least a propulsion-like apparatus 135,efficiently cooling the heat-generating electric and/or electronicelements, devices and/or systems, submerged within the dielectricthermally conductive fluid.

FIG. 9 depicts a representation of an embodiment of a single-phaseimmersion cooling system without a heat exchanger and at least a fanunit. Referring to FIG. 9, and referring to FIGS. 1A to 8, in someembodiments, the fluid-tight containment vessel 190, 199 comprises acontainment vessel 190 having a vessel opening and a containment cover199 configured to fluid-tight mount to the vessel opening. Thedielectric thermally conductive fluid, at least a heat-generatingelectronic device 150, 155, and first and second opening 119, 129 arecontained within the fluid-tight containment vessel 190, 199 via thevessel opening.

The fluid-tight containment vessel 190, 199 comprising the containmentvessel 190 having the vessel opening and the containment cover 199configured to fluid-tight mount to the vessel opening, easily and simplyprovide access to a user for filling of the dielectric thermallyconductive fluid, decreasing total installation time.

The single-phase immersion cooling system 100 decreases risks forleakage as risks for a liquid-cooling system having a heat exchanger inthermal contact with the electric and/or electronic elements, devicesand/or systems, transporting heat away therefrom are greater, due toleakage along any one of conduits, mounting portions, and heatexchangers of the liquid-cooling system causing damage to thenon-submersible electric and/or electronic elements, devices and/orsystems. The fluid-tight containment vessel 190, 199 also preventscontact of the heat-generating electric and/or electronic elements,devices and/or systems during operation with the surroundingenvironment, decreasing damage due to high temperature, high humidity,oily or dusty air, and/or salty coastal area environments.

In some embodiments, the single-phase immersion cooling system 100further comprises at least a fluid-tight first conduit access entranceand at least a fluid-tight second conduit access entrance. The at leasta fluid-tight first conduit access entrance is through the fluid-tightcontainment vessel 190, 199 and is configured to provide at least thefirst conduit 110 from an exterior of the fluid-tight containment vessel190, 199 to an interior of the fluid-tight containment vessel 190, 199for access to the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199. The at least a fluid-tightsecond conduit access entrance is through the fluid-tight containmentvessel 190, 199 and configured to provide at least the second conduit120 from an exterior of the fluid-tight containment vessel 190, 199 toan interior of the fluid-tight containment vessel 190, 199 for access tothe dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199.

In some embodiments, the at least a heat-generating electronic device150, 155 comprises at least one of a motherboard, printed circuit board,central processing unit (CPU), CPU chipset, graphics processing units(GPU), physics processing unit (PPU), memory, storage device, orlighting, or any combination of the foregoing, mounted on a motherboardand/or expansion card, or the like. Examples of motherboards compriseMicroATX, full size ATX and/or larger motherboards etc. Examples ofstorage devices and components comprise solid state drives, non-volatilememory express, and, hard disk drives etc.

In some embodiments, the single-phase immersion cooling system 100further comprises at least a fluid-tight cable access entrance (notshown) through the fluid-tight containment vessel 190, 199. The at leasta fluid-tight cable access entrance is configured to provide at leastone of a control cable, data cable, communications cable, or signalcable, or any combination of the foregoing, from an exterior of thefluid-tight containment vessel 190, 199 to an interior of thefluid-tight containment vessel 190, 199 for further access to the atleast a heat-generating electronic device 150, 155.

In some embodiments, the single-phase immersion cooling system 100further comprises a power supply unit 140 submerged within thedielectric thermally conductive fluid. The power supply unit 140 isconfigured to provide power to the at least a heat-generating electronicdevice 150, 155, wherein the at least a fluid-tight cable accessentrance through the fluid-tight containment vessel 190, 199 is furtherconfigured to provide at least a power cable 143 from an exterior of thefluid-tight containment vessel 190, 199 to an interior of thefluid-tight containment vessel 190, 199 for further access to the powersupply unit 140.

The fluid-tight cable and conduit access entrances provides easy andsimple mounting and access to a user for control cables, data cables,communications cables, signal cables, and/or power cables, from theexterior of the fluid-tight containment vessel 190, 199 to the interiorof the fluid-tight containment vessel 190, 199 for access to the atleast a heat-generating electronic device 150, 155 and/or power supplyunit 140, respectively. As an example, audio ports, ethernet ports,display ports, VGA ports, digital visual interface (DVI) and/orhigh-definition multimedia interfaces (HDMIs) may be mounted to anoutside of the fluid-tight containment vessel 190, 199 and connected bycables 153, 157, from the exterior of the fluid-tight containment vessel190, 199 to the interior of the fluid-tight containment vessel 190, 199for access to the at least a heat-generating electronic device 150, 155.

It is readily appreciated that any suitable type, style, size, materialand amount of fluid-tight attachment means may be implemented by thoseof ordinary skill in the relevant art within the single-phase immersioncooling system 100 and the embodiments are not limited thereto. Examplesof fluid-tight attachment means comprise gluing, welding, or gasketing,or any combination of the foregoing etc. As long as the first and secondopening 119, 129 generate at least a steady flow channel for directing asteady flow of the dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel 190, 199.

In some embodiments, the single-phase immersion cooling system 100further comprises a removable bracket structure 160 disposed and mountedwithin the fluid-tight containment vessel 190, 199, configured formounting of the power supply unit 140 and the at least a heat-generatingelectronic device 150, 155 thereto.

The removable bracket structure 160 disposed and mounted within thefluid-tight containment vessel 190, 199, configured for mounting of theheat-generating electric and/or electronic elements, devices and/orsystems thereto, easily and simply provide access to a user for mountingof the heat-generating electric and/or electronic elements, devicesand/or systems, decreasing total installation time.

FIG. 10 depicts a cross-sectional view of an embodiment of the conduitsof a single-phase immersion cooling system. Referring to FIG. 10, andreferring to FIGS. 1A to 9, in certain embodiments, the single-phaseimmersion cooling system further comprises at least a first conduit 210having a third modifiable portion 213, 215 and at least a second conduit220 having a fourth modifiable portion 225.

FIG. 11 depicts a cross-sectional view of an alternative embodiment of asingle-phase immersion cooling system. FIG. 12 depicts a cross-sectionalview of the alternative embodiment of FIG. 11 from an opposing side.FIG. 13 depicts a representation of an alternative embodiment ofconduits, a pump, a power supply unit, a motherboard and a printedcircuit board. FIG. 14 depicts a representation of an alternativeembodiment of conduits, a pump, a power supply unit and a printedcircuit board. FIG. 15 depicts a representation of an alternativeembodiment of conduits, a pump, and a power supply unit. Referring toFIGS. 10 to 15, and referring to FIGS. 1A and 1B, FIGS. 7A and 7B, FIG.8, and FIG. 9, the third modifiable portion 213, 215 comprises a thirdopening 219 submerged within the dielectric thermally conductive fluidand the fourth modifiable portion 225 comprises a fourth opening 229submerged within the dielectric thermally conductive fluid. The firstmodifiable portion 115 is dismounted from the at least a first conduit210 and the third modifiable portion 213, 215 is mounted to the at leasta first conduit 210 and the second modifiable portion 125 is dismountedfrom the at least a second conduit 220 and the fourth modifiable portion225 is mounted to the at least a second conduit 220. At least one of thefirst conduit 210 or second conduit 220 circulates dielectric thermallyconductive fluid from the heat exchanger outlet into the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 and the other of the first conduit 210 or second conduit220 circulates dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 thereout to the heatexchanger inlet via the pump 130. The third and fourth openings 219, 229are disposed near to greatest opposing ends of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199 which are different from that of the disposition of the firstand second openings 119, 129. The lengths and shapes of the first andthird modifiable portions 115, 213, 215 and lengths and shapes of thesecond and fourth modifiable portions 125, 225 are different,respectively, and the disposition of the third and fourth openings 219,229 generate at least a third flow channel, different from the firstflow channel, for directing a third flow of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199. In certain embodiments, the third modifiable portion 213 isnearer to the fourth modifiable portion 225 than the third modifiableportion 215, whereby the third opening 219 is nearer to an inner side ofthe removable bracket structure 160 than the fourth opening 229.

In certain embodiments, the pump 130 of the single-phase immersioncooling system, together with the disposition of the third and fourthopening 219, 229, generate at least a third flow channel for directing athird flow of the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199, however, the embodimentsare not limited thereto. Those having ordinary skill in the relevant artmay readily appreciate that the pump 130 of the single-phase immersioncooling system 100, together with the disposition of a fifth opening291A and fourth opening 229 may generate at least a fifth flow channelfor directing a fifth flow of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel 190, 199. Thosehaving ordinary skill in the relevant art may also readily appreciatethat apparatuses and devices that supplement and enhance the at least afifth flow channel for directing the fifth flow of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199, may also be implemented in the embodiments.

FIG. 16 depicts a representation of an embodiment of conduits, a pump, apower supply unit, a printed circuit board and a propulsion-likeapparatus. Referring to FIG. 16, and referring to FIGS. 1A-2B, 7A-9, and10-15, the single-phase immersion cooling systems of FIGS. 1A-2B, 7A-9,and 10-15 may be similar in some respects to the single-phase immersioncooling system of FIG. 16, and thus may be best understood withreference thereto where like numerals designate like components notdescribed again in detail. Unlike the single-phase immersion coolingsystems of FIGS. 1A-2B, 7A-7B, 9, and 10-15 and similar in some respectsto the single-phase immersion cooling systems of FIG. 8, thesingle-phase immersion cooling system of FIG. 16 further comprises atleast a fifth conduit 210A having a fifth modifiable portion 213A, 215Aand at least a second conduit 220 having a fourth modifiable portion 225and at least a propulsion-like apparatus 135 and a mount or stand 139A.The fifth modifiable portion 213A, 215A comprises a fifth opening 219Asubmerged within the dielectric thermally conductive fluid and thefourth modifiable portion 225 comprises a fourth opening 229 submergedwithin the dielectric thermally conductive fluid. The first modifiableportion 115 is dismounted from the at least a first conduit 210 and thefifth modifiable portion 213A, 215A is mounted to the at least a firstconduit 210 and the second modifiable portion 125 is dismounted from theat least a second conduit 220 and the fourth modifiable portion 225 ismounted to the at least a second conduit 220. At least one of the firstconduit 210 or second conduit 220 circulates dielectric thermallyconductive fluid from the heat exchanger outlet into the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 and the other of the first conduit 210 or second conduit220 circulates dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 thereout to the heatexchanger inlet via the pump 130. The fifth and fourth openings 219A,229 are disposed near to greatest opposing ends of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 which are different from that of the disposition of thefirst and second openings 119, 129 and third opening 219. The lengthsand shapes of the first, third and fifth modifiable portions 115, 213,215, 213A, 215A and lengths and shapes of the second and fourthmodifiable portions 125, 225 are different, respectively, and thedisposition of the fifth and fourth openings 219A, 229 generate at leasta fifth flow channel, different from the first flow channel and thirdflow channel, for directing a fifth flow of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199. In certain embodiments, the fifth modifiable portion 213A isnearer to an inner side of the removable bracket structure 160 than thefifth modifiable portion 215A, whereby the fifth opening 219A is nearerto the power supply unit 140 than the fourth opening 229. The at least apropulsion-like apparatus 135 is configured to supplement and enhancethe at least a fifth flow channel for directing the fifth flow of thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel 190, 199 generated by the pump 130, together with thedisposition of the first and second opening 119, 129. The at least apropulsion-like apparatus 135 is mounted to the mount or stand 139.

In certain embodiments, dielectric thermally conductive fluid (notshown) is contained within the fluid-tight containment vessel 190, 199and the at least a heat-generating electronic device 150, 155 issubmerged within the dielectric thermally conductive fluid. The heatexchanger system comprises the pump 130, the heat exchanger 170, the atleast a first conduit 110, the at least a second conduit 120, the atleast a propulsion-like apparatus 135 and a mount or stand 139A. Theheat exchanger 170 has a heat exchanger inlet and a heat exchangeroutlet. The at least a fifth conduit 210A has a fifth modifiable portion213A, 215A comprising a fifth opening 219A submerged within thedielectric thermally conductive fluid. The at least a fourth conduit 220has a fourth modifiable portion 225 comprising a fourth opening 229submerged within the dielectric thermally conductive fluid. The at leasta propulsion-like apparatus 135 comprises at least a propeller, a motor,and a frame. The propeller is electrically connected to the motor. Thepropeller and motor are mounted to the frame. The at least apropulsion-like apparatus 135 is configured to convert rotationalmovement to thrust to move dielectric thermally conductive fluid fromone face of the at least a propulsion-like apparatus 135 to an oppositeface of the at least a propulsion-like apparatus 135. Thus, the at leasta propulsion-like apparatus 135 supplements and enhances the at least afifth flow channel for directing the first flow of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 generated by the pump 130, together with the dispositionof the fifth and fourth opening 219A, 229. The mount or stand 139A isdisposed next to the pump 130 and comprise at least two openings 138.The at least a fifth modifiable portion 213A, 215A at least partiallyextends between the at least two openings 138A undisturbed.

In certain embodiments, at least one of the at least a first conduit210A or second conduit 220 circulates dielectric thermally conductivefluid from the heat exchanger outlet into the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199 and the other of the first conduit 210A or second conduit 220circulates dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199 thereout to the heat exchangerinlet via the pump 130. The fifth and fourth opening 219A, 229 aredisposed near to greatest opposing ends of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199. The at least a propulsion-like apparatus 135 is positionedbetween the fifth and fourth opening 219A, 229. The direction of thrustto move dielectric thermally conductive fluid from one face of the atleast a propulsion-like apparatus 135 to an opposite face of the atleast a propulsion-like apparatus 135 is dependent on which of at leastone of the at least a first conduit 210A or second conduit 220circulates dielectric thermally conductive fluid from the heat exchangeroutlet into the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 and which one of the otherof the first conduit 210A or second conduit 220 circulates dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 thereout to the heat exchanger inlet via the pump 130.The general direction of the at least a fifth flow channel for directingthe fifth flow of the dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel 190, 199 generated by the pump130, together with the disposition of the fifth and fourth opening 219A,229 circulating dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 is the same as the directionof thrust moving liquid from one face of the at least a propulsion-likeapparatus 135 to the opposite face of the at least a propulsion-likeapparatus 135.

It is readily appreciated that any suitable type, style, size, andamount of the at least a propulsion-like apparatus 135 configured forunderwater and immersible usage, for different capacities (flow rate),and of various non-rust materials, may be implemented by those ofordinary skill in the relevant art within the single-phase immersioncooling system and the embodiments are not limited thereto. As long asdielectric thermally conductive fluid is circulated from an outlet ofthe heat exchanger radiator 170 into the dielectric thermally conductivefluid contained within the fluid-tight containment vessel 190, 199through a conduit 210A, 220, and dielectric thermally conductive fluidcontained within the fluid-tight containment vessel 190, 199 iscirculated thereout to an inlet of the heat exchanger radiator 170through an other conduit 210A, 220, via the pump 130, and issupplemented and enhanced by the at least a propulsion-like apparatus135, efficiently cooling the heat-generating electric and/or electronicelements, devices and/or systems, submerged within the dielectricthermally conductive fluid.

In certain embodiments, the pump 130 of the single-phase immersioncooling system 100 is submerged within the dielectric thermallyconductive fluid within the fluid-tight containment vessel 190, 199. Incertain embodiments, the pump 130 of the single-phase immersion coolingsystem 100 is mounted to an outer side of the fluid-tight containmentvessel 190, 199 (not shown).

In certain embodiments, the heat exchanger 170 of the single-phaseimmersion cooling system comprises a heat exchanger radiator 170,mounted to an outer side of the fluid-tight containment vessel 190, 199.In certain embodiments, the heat exchanger 170 of the single-phaseimmersion cooling system 100 further comprises at least a fan unit 180mounted to the heat exchanger radiator 170, opposite to the outer sideof the fluid-tight containment vessel 190, 199. In certain embodiments,the heat exchanger radiator 170 of the single-phase immersion coolingsystem 100 comprises at least a built-in fluid tank reservoir to sidesthereof (not shown) having reservoir openings (not shown), wherebydielectric thermally conductive fluid is added into the built-in fluidtank reservoir. A volume of the dielectric thermally conductive fluidmay be retained in the fluid tank during operation of the single-phaseimmersion cooling system 100. In some embodiments, a visible portion ofthe dielectric thermally conductive fluid in the fluid tank via atransparent material may allow users to visually observe an amount ofthe dielectric thermally conductive fluid in the cooling loop, anddetermine when additional dielectric thermally conductive fluid may needto be added (not shown). Via the fluid tank, the dielectric thermallyconductive fluid loss over time due to permeation may be mitigated, andair bubbles may gradually be replaced during fluid circulation,increasing cooling loop efficiency of the single-phase immersion coolingsystem.

In certain embodiments, the pump 130 of the single-phase immersioncooling system 100 is submerged within the dielectric thermallyconductive fluid within the fluid-tight containment vessel 190, 199. Incertain embodiments, the pump 130 of the single-phase immersion coolingsystem 100 is mounted to an outer side of the fluid-tight containmentvessel 190, 199 (not shown).

In certain embodiments, the heat exchanger 170 of the single-phaseimmersion cooling system 100 comprises a heat exchanger radiator 170,mounted to an outer side of the fluid-tight containment vessel 190, 199.In certain embodiments, the heat exchanger 170 of the single-phaseimmersion cooling system 100 further comprises at least a fan unit 180mounted to the heat exchanger radiator 170, opposite to the outer sideof the fluid-tight containment vessel 190, 199. In certain embodiments,the heat exchanger radiator 170 of the single-phase immersion coolingsystem 100 comprises at least a built-in fluid tank reservoir to sidesthereof (not shown) having reservoir openings (not shown), wherebydielectric thermally conductive fluid is added into the built-in fluidtank reservoir. A volume of the dielectric thermally conductive fluidmay be retained in the fluid tank during operation of the single-phaseimmersion cooling system 100. In some embodiments, a visible portion ofthe dielectric thermally conductive fluid in the fluid tank via atransparent material may allow users to visually observe an amount ofthe dielectric thermally conductive fluid in the cooling loop, anddetermine when additional dielectric thermally conductive fluid may needto be added (not shown). Via the fluid tank, the dielectric thermallyconductive fluid loss over time due to permeation may be mitigated, andair bubbles may gradually be replaced during fluid circulation,increasing cooling loop efficiency of the single-phase immersion coolingsystem 100.

It is readily appreciated that any suitable type, style, and size of theheat exchanger radiator 170 may be implemented by those of ordinaryskill in the relevant art within the single-phase immersion coolingsystem 100 and the embodiments are not limited thereto. As long asdielectric thermally conductive fluid is circulated from an outlet ofthe heat exchanger radiator 170 into the dielectric thermally conductivefluid contained within the fluid-tight containment vessel 190, 199through a conduit, and dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel 190, 199 is circulatedthereout to an inlet of the heat exchanger radiator 170 through an otherconduit, via the pump 130, efficiently cooling the heat-generatingelectric and/or electronic elements, devices and/or systems submergedwithin the dielectric thermally conductive fluid.

The at least a fan unit 180 may be coupled to the back end of the heatexchanger radiator 170 via a fastener (e.g., bolts, screws, an adhesivematerial, etc.) at structural portions of the heat exchanger radiator170, transporting air through the heat exchanger radiator 170 to an airplenum or to an exterior of the fluid-tight containment vessel 190, 199.Those of ordinary skill in the relevant art may readily appreciate thatthe type and size of fans may be varied, as long as dielectric thermallyconductive fluid may be circulated through the heat exchanger radiator170 and air may be transferred through the heat exchanger radiator 170to an air plenum or to an exterior of the fluid-tight containment vessel190, 199.

The at least a fan unit 180 may be high pressure (e.g., a high airflow)fans. The at least a fan unit 180 may have reinforced fan blades. Thedesign of the fan blades and/or other components (e.g., bearings, etc.)may be such that noise generated during operation may be minimized. Theat least a fan unit 180 may be constructed using fasteners (e.g.,anti-vibration rivets, gaskets, etc.) that may be used to minimizedvibration during operation.

FIG. 17 depicts a representation of another alternative embodiment of asingle-phase immersion cooling system. Referring to FIG. 17, andreferring to FIGS. 4-7B, 8, 13-15, and 16 the single-phase immersioncooling system of FIGS. 4-7B, 8, 13-15, and 16 may be similar in somerespects to the single-phase immersion cooling system 300 of FIG. 17,and thus may be best understood with reference thereto where likenumerals designate like components not described again in detail. Unlikethe single-phase immersion cooling system of Figs. FIGS. 4-7B, 8, 13-15,and 16, the single-phase immersion cooling system 300 of FIG. 17comprises a fin chambered heat exchanger 370. The fin chambered heatexchanger 370 may be mounted to the outer side of the fluid-tightcontainment vessel 390, 399, or integrated with a paneling thereof. Thefin chambered heat exchanger 370, comprises a fluid chamber 372 andplurality of heatsink fins 378. The fluid chamber 372 has a first outlet319 and a second outlet 329, whereby the at least a first conduit 110,210, 210A having the first, third, and fifth modifiable portions 115,213, 215, 213A, 215A comprising a first, third, and fifth opening 119,219, 219A submerged within the dielectric thermally conductive fluid andthe at least a second conduit 120, 220 having the second, and fourthmodifiable portions 125, 225 comprising a second, and fourth opening129, 229 submerged within the dielectric thermally conductive fluid maybe fluid-tight mounted thereto. The dielectric thermally conductivefluid is circulated from either one of the first outlet 319 or secondoutlet 329 into the dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel 390, 399 through either one ofthe at least a first conduit 110, 210, 210A or second conduit 120, 220.The dielectric thermally conductive fluid contained within thefluid-tight containment vessel 390, 399 is circulated thereout to theother one of the first outlet 319 or second outlet 329 through the otherone of the at least a first conduit 110, 210, 210A or second conduit120, 220, via the pump 130, efficiently cooling the heat-generatingelectric and/or electronic elements, devices and/or systems, submergedwithin the dielectric thermally conductive fluid.

In certain embodiments, the fluid chamber 372 comprises an outer casingand an inner casing; the inner casing is in direct contact with thedielectric thermally conductive fluid circulating within thesingle-phase immersion cooling system 300 and the outer casing iscorresponding to, fluid-tight mounted to and opposite the inner casing.The outer and inner casings form a chamber therewithin, configured togenerate a chamber flow thereabout. The chamber flow circulates thedielectric thermally conductive fluid throughout the chamber via flowingand/or braided channels. As an example, the fluid chamber 372 maycomprise at least three flowing channels, connected by two turningpoints; however, the embodiments are not limited thereto. Those havingordinary skill in the relevant art may readily appreciate that the fluidchamber 372 may comprise more than three flowing channels, connected bymore than two turning points, in various flowing shapes, in combinationwith, braided channels defined by island-like structures, or any numberof braided channels defined by island-like structures throughout thefluid chamber 372. As long as the chamber flow circulates the dielectricthermally conductive fluid throughout the chamber.

In certain embodiments, upper most outer portions of the plurality ofheatsink fins 378 do not exceed a plane of the paneling of the outerside of the fluid-tight containment vessel 390, 399; however, theembodiments are not limited thereto. Those of ordinary skill in therelevant art may readily appreciate that the plurality of heatsink fins378 may exceed the plane of the paneling of the outer side of thefluid-tight containment vessel 390, 399.

In certain embodiments, the plurality of heatsink fins 378 is inindirect contact with the dielectric thermally conductive fluid flowingthrough the flowing and/or braided channels; however, the embodimentsare not limited thereto. FIG. 18A depicts a representation of an innerpanel of the another alternative embodiment of a single-phase immersioncooling system of FIG. 17. FIG. 18B depicts a plane view of the innerpanel of the another alternative embodiment of a single-phase immersioncooling system FIG. 18A. In certain embodiments, at least one of theplurality of heatsink fins 378 may be in direct contact with thedielectric thermally conductive fluid flowing through the flowing and/orbraided channels via a fin input, fin channel, and fin output thereof.The fin input and output is in direct communication with the dielectricthermally conductive fluid flowing through the flowing and/or braidedchannels and the fin channel is in direct communication with the fininput and output.

It is readily appreciated that any suitable type, style, size, andamount of the fin chambered heat exchanger 370 may be implemented bythose of ordinary skill in the relevant art within the single-phaseimmersion cooling system 300 and the embodiments are not limitedthereto. As long as dielectric thermally conductive fluid is circulatedthereout into the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 390, 399 through a conduit, anddielectric thermally conductive fluid contained within the fluid-tightcontainment vessel 390, 399 is circulated therein through an otherconduit, via the pump 130, efficiently cooling the heat-generatingelectric and/or electronic elements, devices and/or systems submergedwithin the dielectric thermally conductive fluid.

In some embodiments, the dielectric thermally conductive fluid of thesingle-phase immersion cooling system 100 comprises a single-phasefluid. Examples of dielectric thermally conductive fluid comprisehydrocarbons such as mineral oils, synthetic oils, and natural oils,and/or engineered dielectric thermally conductive fluids etc.

In some embodiments, the fluid-tight containment vessel 190, 199 of thesingle-phase immersion cooling system 100 comprises at least one of ametal, plastic, or transparent plastic material, or any combination ofthe foregoing. Examples of metal materials comprise magnesium andaluminium etc. and examples of plastic materials comprise ABS, PC, andAcrylic etc.

In an embodiment, a single-phase immersion cooling method, comprisingproviding a single-phase immersion cooling system 100 and circulating adielectric thermally conductive fluid therewithin is provided. Thesingle-phase immersion cooling method comprises providing thesingle-phase immersion cooling system 100 including providing afluid-tight containment vessel 190, 199, providing a dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199, providing at least a heat-generating electronic device150, 155 submerged within the dielectric thermally conductive fluid, andproviding a heat exchanger system. The heat exchanger system of themethod comprises a pump 130, a heat exchanger 170 having a heatexchanger inlet and a heat exchanger outlet, at least a first conduit110 having a first modifiable portion 115 comprising a first opening 119submerged within the dielectric thermally conductive fluid, and at leasta second conduit 120 having a second modifiable portion 125 comprising asecond opening 129 submerged within the dielectric thermally conductivefluid. The method further comprises circulating, via the pump 130,dielectric thermally conductive fluid from the heat exchanger outletinto the dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199 through at least one of thefirst conduit 110 or second conduit 120 and circulating, via the pump130, dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199 thereout to the heat exchangerinlet through the other of the first conduit 110 or second conduit 120.The first and second opening 119, 129 of the method are disposed near togreatest opposing ends of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel 190, 199.

In certain embodiments of the method, the method further comprisesgenerating at least a first flow channel for directing a first flow ofthe dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199 via the disposition of the firstand second openings 119, 129.

In certain embodiments of the method, the heat exchanger system of themethod comprises a pump 130, a heat exchanger 170 having a heatexchanger inlet and a heat exchanger outlet, at least a first conduit110 having a first modifiable portion 115 comprising a first opening 119submerged within the dielectric thermally conductive fluid, at least asecond conduit 120 having a second modifiable portion 125 comprising asecond opening 129 submerged within the dielectric thermally conductivefluid, at least a propulsion-like apparatus 135, and a mount or stand139. The method further comprises circulating, via the pump 130 andsupplemented and enhanced by the at least a propulsion-like apparatus135, dielectric thermally conductive fluid from the heat exchangeroutlet into the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 through at least one of thefirst conduit 110 or second conduit 120 and circulating, via the pump130 and supplemented and enhanced by the at least a propulsion-likeapparatus 135, dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 thereout to the heatexchanger inlet through the other of the first conduit 110 or secondconduit 120. The first and second opening 119, 129 of the method aredisposed near to greatest opposing ends of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199.

Other features and principles of the method for circulating a dielectricthermally conductive fluid within a single-phase immersion coolingsystem 100 are generally the same as and described in detail in theembodiments of the single-phase immersion cooling system 100 above, andfor sake of brevity, will not repeated hereafter.

In certain embodiments of the method, the method further comprisesproviding at least a first conduit 210 having a third modifiable portion213, 215 comprising a third opening 219 submerged within the dielectricthermally conductive fluid and providing at least a second conduit 220having a fourth modifiable portion 225 comprising a fourth opening 229submerged within the dielectric thermally conductive fluid. The methodfurther comprises dismounting the first modifiable portion 115 from theat least a first conduit 110 and mounting the third modifiable portion213, 215 to the at least a first conduit 210 and dismounting the secondmodifiable portion 225 from the at least a second conduit 120 andmounting the fourth modifiable portion 225 to the at least a secondconduit 220. Also, the method further comprises circulating, via thepump 130, dielectric thermally conductive fluid from the heat exchangeroutlet into the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel 190, 199 through at least one of thefirst conduit 210 or second conduit 220 and circulating, via the pump130, dielectric thermally conductive fluid contained within thefluid-tight containment vessel 190, 199 thereout to the heat exchangerinlet through the other of the first conduit 210 or second conduit 220.The single-phase immersion cooling method further comprises generatingat least a third flow channel for directing a third flow of thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel 190, 199 via the disposition of the third and fourthopenings 219, 229. The third and fourth openings 219, 229 of thesingle-phase immersion cooling method are disposed near to greatestopposing ends of the dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel 190, 199 which are differentfrom that of the disposition of the first and second openings 119, 129,whereby the lengths and shapes of the first and third modifiableportions 115, 213, 215 and lengths and shapes of the second and fourthmodifiable portions 125, 225 are different, respectively.

Other features and principles of the method for circulating a dielectricthermally conductive fluid within a single-phase immersion coolingsystem 100 are generally the same as and described in detail in theembodiments of the single-phase immersion cooling system 100 above, andfor sake of brevity, will not repeated hereafter.

In certain embodiments of the method, the heat exchanger system of themethod comprises a pump 130, a heat exchanger 170 having a heatexchanger inlet and a heat exchanger outlet, at least a first conduit210 having a fifth modifiable portion 213A, 215A comprising a fifthopening 219A submerged within the dielectric thermally conductive fluid,at least a second conduit 220 having a fourth modifiable portion 225comprising a fourth opening 229 submerged within the dielectricthermally conductive fluid, at least a propulsion-like apparatus 135,and a mount or stand 139. The method further comprises dismounting thefirst modifiable portion 115 from the at least a first conduit 110 andmounting the fifth modifiable portion 213A, 215A to the at least a firstconduit 210A and dismounting the second modifiable portion 225 from theat least a second conduit 120 and mounting the fourth modifiable portion225 to the at least a second conduit 220. Also, the method furthercomprises circulating, via the pump 130 and supplemented and enhanced bythe at least a propulsion-like apparatus 135, dielectric thermallyconductive fluid from the heat exchanger outlet into the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 through at least one of the first conduit 210 or secondconduit 220 and circulating, via the pump 130 and supplemented andenhanced by the at least a propulsion-like apparatus 135, dielectricthermally conductive fluid contained within the fluid-tight containmentvessel 190, 199 thereout to the heat exchanger inlet through the otherof the first conduit 210 or second conduit 220. The single-phaseimmersion cooling method further comprises generating at least a fifthflow channel for directing a fifth flow of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199 via the disposition of the fifth and fourth openings 219A, 229.The fifth and fourth openings 219A, 229 of the single-phase immersioncooling method are disposed near to greatest opposing ends of thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel 190, 199 which are different from that of thedisposition of the first and second openings 119, 129, whereby thelengths and shapes of the first and fifth modifiable portions 113, 115,213A, 215A and lengths and shapes of the second and fourth modifiableportions 125, 225 are different, respectively.

Other features and principles of the method for circulating a dielectricthermally conductive fluid within a single-phase immersion coolingsystem are generally the same as and described in detail in theembodiments of the single-phase immersion cooling system 100 above, andfor sake of brevity, will not repeated hereafter.

The modifiable portions of the at least a first and second conduits 110,120, 210, 220, 210A, 220 having different and/or same lengths anddifferent and/or same shapes, in any combination, easily andconveniently allow users to exchange an insurmountable amount ofmodifiable portions, each having openings, of the heat exchanger system,to form an insurmountable amount of different flow channels fordirecting a flow of the dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel 190, 199 via the dispositionof the openings 119, 129, 219, 219A, 229. The increased costs, totalinstallation time, risks for leakage, loss of parts, and total arearequirements for the single-phase immersion cooling system 100 are notexacerbated when dispositions of the operating temperatures within theelectric and/or electronic elements, devices and/or systems change, aseasy and simple dismounting and mounting of appropriate modifiableportions easily and simply adjust the flow of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel190, 199 via the disposition of the openings 119, 129, 219, 219A, 229for a most optimal transfer of heat.

Control of the pump, driven by an AC or DC electrical motor, preferablytakes place by means of an operative system or like means or theelectric and/or electronics system itself, wherein the electric and/orelectronics system comprises a means for measuring load and/ortemperature of one or more processors or areas. Using the measurementperformed by the operative system or a like system eliminates the needfor special means for operating the single-phase immersion coolingsystem and method of the same.

Further control strategies utilizing the operative system or a likesystem may involve balancing the rotational speed of the pump as afunction of the cooling capacity needed. If a lower cooling capacity isneeded, the rotational speed of the pump may be adjusted or limited,thereby limiting the noise generated by a motor of the pump driving thesingle-phase immersion cooling system and wear and tear thereof.

Functionality and applicability of electric and electronic elements,devices and systems continually increase, increasing the powerrequirements thereof, and in turn, increasing cooling requirements. Aliquid-cooling system, wherein a heat exchanger is in thermal contactwith the elements, devices and/or systems, transporting heat awaytherefrom, and then cooling fluid, circulating within a cooling loopsystem incorporating the heat exchanger, flowing over the heat exchangerby a pumping unit, removing heat therefrom, is one technique that hasbeen developed for extracting heat from the electric and electronicelements, devices and systems. However, as operating temperaturesincrease so do costs, total installation time, risks for leakage, lossof parts, and total area requirements for the liquid-cooling systems.The increased costs, total installation time, risks for leakage, loss ofparts, and total area requirements for the liquid-cooling systems areexacerbated when dispositions of the operating temperatures within theelectric and electronic systems change.

In the embodiments, fluid cooling systems and single-phase immersioncooling systems and methods of the same, for cooling heat-generatingelectronic devices via circulating fluid in a fluid-tight containmentvessel, comprising a fluid-tight containment vessel, dielectricthermally conductive fluid, at least a heat-generating electronicdevice, and heat exchanger system are provided. The heat exchangersystem comprises a pump, heat exchanger, at least a first conduit, atleast a second conduit, a stand, and at least a propulsion-likeapparatus. The at least a first and second conduits have first andsecond modifiable portions comprising first and second openingssubmerged within the dielectric thermally conductive fluid,respectively. At least one of the at least a first conduit or secondconduit circulates dielectric thermally conductive fluid from a heatexchanger outlet into the fluid-tight containment vessel and the otherof the first conduit or second conduit circulates dielectric thermallyconductive fluid from the fluid-tight containment vessel to a heatexchanger inlet via the pump. The first and second openings are disposednear to greatest opposing ends of the dielectric thermally conductivefluid contained within the fluid-tight containment vessel generating atleast a first flow channel for directing a first flow of the dielectricthermally conductive fluid. The at least a propulsion-like apparatusmoves the dielectric thermally conductive fluid from one face to anopposite face in the same direction as the first flow, supplementing andenhancing circulation within the fluid-tight containment vessel.

In the embodiments, the heat exchanger system circulates dielectricthermally conductive fluid from the heat exchanger outlet into thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel through at least one of a first conduit or secondconduit, and circulates dielectric thermally conductive fluid containedwithin the fluid-tight containment vessel thereout to the heat exchangerinlet through the other of the first conduit or second conduit,supplemented and enhanced by the at least a propulsion-like apparatus,efficiently cooling heat-generating electric and/or electronic elements,devices and/or systems, decreasing a requirement for and/or requirementfor an amount of cooling components, as an example, such as interfacematerials, heat sinks, heat sink fins, and fans etc., for coolingthereof, decreasing costs, total installation time, and total arearequirements.

The removable bracket structure disposed and mounted within thefluid-tight containment vessel, configured for mounting of theheat-generating electric and/or electronic elements, devices and/orsystems thereto, and the fluid-tight containment vessel comprising thecontainment vessel having the vessel opening and the containment coverconfigured to fluid-tight mount to the vessel opening, easily and simplyprovide access to a user for mounting of the heat-generating electricand/or electronic elements, devices and/or systems and filling of thedielectric thermally conductive fluid, decreasing total installationtime. The fluid-tight cable and conduit access entrances also provideseasy and simple mounting and access to a user for control cables, datacables, communications cables, signal cables, and/or power cables, fromthe exterior of the fluid-tight containment vessel to the interior ofthe fluid-tight containment vessel for access to the at least aheat-generating electronic device and/or power supply unit,respectively. Risks for leakage are also decreased as risks for aliquid-cooling system having a heat exchanger in thermal contact withthe electric and/or electronic elements, devices and/or systems,transporting heat away therefrom are greater, due to leakage along anyone of conduits, mounting portions, and heat exchangers of theliquid-cooling system causing damage to the non-submersible electricand/or electronic elements, devices and/or systems. The fluid-tightcontainment vessel also prevents contact of the heat-generating electricand/or electronic elements, devices and/or systems during operation withthe surrounding environment, decreasing damage due to high temperature,high humidity, oily or dusty air, and/or salty coastal areaenvironments.

The modifiable portions of the at least a first and second conduits,having different and/or same lengths and different and/or same shapes,in any combination, easily and conveniently allow users to exchange aninsurmountable amount of modifiable portions, each having openings, ofthe heat exchanger system, to form an insurmountable amount of differentflow channels for directing a flow of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel viathe disposition of the openings. The increased costs, total installationtime, risks for leakage, loss of parts, and total area requirements forthe single-phase immersion cooling system are not exacerbated whendispositions of the operating temperatures within the electric and/orelectronic elements, devices and/or systems change, as easy and simpledismounting and mounting of appropriate modifiable portions easily andsimply adjust the flow of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel via the dispositionof the openings for a most optimal transfer of heat.

The presently disclosed inventive concepts are not intended to belimited to the embodiments shown herein, but are to be accorded theirfull scope consistent with the principles underlying the disclosedconcepts herein. Directions and references to an element, such as “up,”“down,”, “upper,” “lower,” “horizontal,” “vertical,” “left,” “right,”and the like, do not imply absolute relationships, positions, and/ororientations. Terms of an element, such as “first” and “second” are notliteral, but, distinguishing terms. As used herein, terms “comprises” or“comprising” encompass the notions of “including” and “having” andspecify the presence of elements, operations, and/or groups orcombinations thereof and do not imply preclusion of the presence oraddition of one or more other elements, operations and/or groups orcombinations thereof. Sequence of operations do not imply absolutenessunless specifically so stated. Reference to an element in the singular,such as by use of the article “a” or “an”, is not intended to mean “oneand only one” unless specifically so stated, but rather “one or more”.As used herein, “and/or” means “and” or “or”, as well as “and” and “or.”As used herein, ranges and subranges mean all ranges including wholeand/or fractional values therein and language which defines or modifiesranges and subranges, such as “at least,” “greater than,” “less than,”“no more than,” and the like, mean subranges and/or an upper or lowerlimit. All structural and functional equivalents to the elements of thevarious embodiments described throughout the disclosure that are knownor later come to be known to those of ordinary skill in the relevant artare intended to be encompassed by the features described and claimedherein. Moreover, nothing disclosed herein is intended to be dedicatedto the public regardless of whether such disclosure may ultimatelyexplicitly be recited in the claims. No element or concept disclosedherein or hereafter presented shall be construed under the provisions of35 USC 112f unless the element or concept is expressly recited using thephrase “means for” or “step for”.

Given the many possible embodiments to which the disclosed principlesmay be applied, we reserve the right to claim any and all combinationsof features and acts described herein, including the right to claim allthat comes within the scope and spirit of the foregoing description, aswell as the combinations recited, literally and equivalently, in thefollowing claims and any claims presented anytime throughout prosecutionof this application or any application claiming benefit of or priorityfrom this application.

What is claimed is:
 1. A single-phase immersion cooling system,comprising: a fluid-tight containment vessel; a dielectric thermallyconductive fluid contained within the fluid-tight containment vessel; atleast a heat-generating electronic device submerged within thedielectric thermally conductive fluid; a heat exchanger systemcomprising: a pump; a heat exchanger having a heat exchanger inlet and aheat exchanger outlet; at least a first conduit having a firstmodifiable portion comprising a first opening submerged within thedielectric thermally conductive fluid; at least a second conduit havinga second modifiable portion comprising a second opening submerged withinthe dielectric thermally conductive fluid; a stand; and at least apropulsion-like apparatus mounted to the stand, wherein at least one ofthe first conduit or second conduit circulates dielectric thermallyconductive fluid from the heat exchanger outlet into the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel and the other of the first conduit or second conduit circulatesdielectric thermally conductive fluid contained within the fluid-tightcontainment vessel thereout to the heat exchanger inlet, wherein thefirst and second openings are disposed near to greatest opposing ends ofthe dielectric thermally conductive fluid contained within thefluid-tight containment vessel, and wherein the at least apropulsion-like apparatus is configured to supplement and enhance thecirculation of dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel.
 2. The single-phase immersioncooling system of claim 1, wherein the disposition of the first andsecond openings generate at least a first flow channel for directing afirst flow of the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel.
 3. The single-phase immersioncooling system of claim 1, wherein the at least a propulsion-likeapparatus is disposed between the first and second openingssupplementing and enhancing the circulation of dielectric thermallyconductive fluid contained within the fluid-tight containment vessel. 4.The single-phase immersion cooling system of claim 2, wherein the atleast a propulsion-like apparatus converts rotational movement to thrustto move dielectric thermally conductive fluid from one face of the atleast a propulsion-like apparatus to an opposite face of the at least apropulsion-like apparatus, and wherein the direction of the at least afirst flow channel for directing the first flow of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel is the same as the direction of thrust moving dielectricthermally conductive fluid from one face of the at least apropulsion-like apparatus to the opposite face of the at least apropulsion-like apparatus.
 5. The single-phase immersion cooling systemof claim 1, wherein the fluid-tight containment vessel comprises acontainment vessel having a vessel opening and a containment coverconfigured to fluid-tight mount to the vessel opening, whereby thedielectric thermally conductive fluid, at least a heat-generatingelectronic device, and first and second openings are contained withinthe fluid-tight containment vessel via the vessel opening.
 6. Thesingle-phase immersion cooling system of claim 1, wherein dielectricthermally conductive fluid comprises a single-phase fluid.
 7. Thesingle-phase immersion cooling system of claim 1, wherein the at least aheat-generating electronic device comprises at least one of amotherboard, printed circuit board, central processing unit, graphicsprocessing unit, memory, storage device, or lighting, or any combinationof the foregoing.
 8. The single-phase immersion cooling system of claim1, wherein the pump is at least submerged within the dielectricthermally conductive fluid within the fluid-tight containment vessel ormounted to an outer side of the fluid-tight containment vessel.
 9. Thesingle-phase immersion cooling system of claim 1, wherein the heatexchanger comprises a heat exchanger radiator, mounted to an outer sideof the fluid-tight containment vessel.
 10. The single-phase immersioncooling system of claim 8, wherein the heat exchanger further comprisesat least a fan unit mounted to the heat exchanger radiator, opposite tothe outer side of the fluid-tight containment vessel.
 11. Thesingle-phase immersion cooling system of claim 8, wherein the heatexchanger radiator comprises at least a built-in fluid tank reservoirhaving a reservoir opening, whereby dielectric thermally conductivefluid is added into the built-in fluid tank reservoir.
 12. Thesingle-phase immersion cooling system of claim 1, further comprising: atleast a fluid-tight first conduit access entrance through thefluid-tight containment vessel, configured to provide at least the firstconduit from an exterior of the fluid-tight containment vessel to aninterior of the fluid-tight containment vessel for access to thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel; and at least a fluid-tight second conduit accessentrance through the fluid-tight containment vessel, configured toprovide at least the second conduit from an exterior of the fluid-tightcontainment vessel to an interior of the fluid-tight containment vesselfor access to the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel.
 13. The single-phase immersioncooling system of claim 1, further comprising: a power supply unitsubmerged within the dielectric thermally conductive fluid, configuredto provide power to the at least a heat-generating electronic device; aremovable bracket structure disposed and mounted within the fluid-tightcontainment vessel, configured for mounting of the power supply unit andthe at least a heat-generating electronic device thereto; and at least afluid-tight cable access entrance through the fluid-tight containmentvessel, configured to provide at least one of a control cable, datacable, communications cable, or signal cable, or any combination of theforegoing, from an exterior of the fluid-tight containment vessel to aninterior of the fluid-tight containment vessel for further access to atleast one of the at least a power supply unit and the at least aheat-generating electronic device.
 14. The single-phase immersioncooling system of claim 1, further comprising: at least a first conduithaving a third modifiable portion comprising a third opening submergedwithin the dielectric thermally conductive fluid; and at least a secondconduit having a fourth modifiable portion comprising a fourth openingsubmerged within the dielectric thermally conductive fluid, wherein thefirst modifiable portion is dismounted from the at least a first conduitand the third modifiable portion is mounted to the at least a firstconduit and the second modifiable portion is dismounted from the atleast a second conduit and the fourth modifiable portion is mounted tothe at least a second conduit, wherein at least one of the first conduitor second conduit circulates dielectric thermally conductive fluid fromthe heat exchanger outlet into the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel and the other of thefirst conduit or second conduit circulates dielectric thermallyconductive fluid contained within the fluid-tight containment vesselthereout to the heat exchanger inlet, wherein the third and fourthopenings are disposed near to greatest opposing ends of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel which are different from that of the disposition of the first andsecond openings, whereby the lengths and shapes of the first and thirdmodifiable portions and lengths and shapes of the second and fourthmodifiable portions are different, respectively, wherein the dispositionof the third and fourth openings generate at least a third flow channel,different from the first flow channel, for directing a third flow of thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel, and wherein the at least a propulsion-like apparatusis disposed between the first and second openings supplementing andenhancing the circulation of dielectric thermally conductive fluidcontained within the fluid-tight containment vessel.
 15. Thesingle-phase immersion cooling system of claim 1, further comprising: atleast a first conduit having a fifth modifiable portion comprising afifth opening submerged within the dielectric thermally conductivefluid; and at least a second conduit having a fourth modifiable portioncomprising a fourth opening submerged within the dielectric thermallyconductive fluid, wherein the first modifiable portion is dismountedfrom the at least a first conduit and the fifth modifiable portion ismounted to the at least a first conduit and the second modifiableportion is dismounted from the at least a second conduit and the fourthmodifiable portion is mounted to the at least a second conduit, whereinat least one of the first conduit or second conduit circulatesdielectric thermally conductive fluid from the heat exchanger outletinto the dielectric thermally conductive fluid contained within thefluid-tight containment vessel and the other of the first conduit orsecond conduit circulates dielectric thermally conductive fluidcontained within the fluid-tight containment vessel thereout to the heatexchanger inlet, wherein the fifth and fourth openings are disposed nearto greatest opposing ends of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel which are differentfrom that of the disposition of the first and second openings, wherebythe lengths and shapes of the first and fifth modifiable portions andlengths and shapes of the second and fourth modifiable portions aredifferent, respectively, wherein the disposition of the fifth and fourthopenings generate at least a fifth flow channel, different from thefirst flow channel, for directing a fifth flow of the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel, and wherein the at least a propulsion-like apparatus is disposedbetween the first and second openings supplementing and enhancing thecirculation of dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel.
 16. The single-phase immersioncooling system of claim 1, wherein the fluid-tight containment vesselcomprises at least one of a metal, plastic, or transparent plasticmaterial, or any combination of the foregoing.
 17. A single-phaseimmersion cooling method, comprising: providing a fluid-tightcontainment vessel; providing a dielectric thermally conductive fluidcontained within the fluid-tight containment vessel; providing at leasta heat-generating electronic device submerged within the dielectricthermally conductive fluid; providing a heat exchanger systemcomprising: a pump; a heat exchanger having a heat exchanger inlet and aheat exchanger outlet; at least a first conduit having a firstmodifiable portion comprising a first opening submerged within thedielectric thermally conductive fluid; at least a second conduit havinga second modifiable portion comprising a second opening submerged withinthe dielectric thermally conductive fluid; a stand; and at least apropulsion-like apparatus mounted to the stand, circulating, via thepump, and supplementing and enhancing via the at least a propulsion-likeapparatus, dielectric thermally conductive fluid from the heat exchangeroutlet into the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel through at least one of the firstconduit or second conduit; and circulating, via the pump, dielectricthermally conductive fluid contained within the fluid-tight containmentvessel thereout to the heat exchanger inlet through the other of thefirst conduit or second conduit, wherein the first and second openingsare disposed near to greatest opposing ends of the dielectric thermallyconductive fluid contained within the fluid-tight containment vessel,and wherein the at least a propulsion-like apparatus supplements andenhances the circulation of dielectric thermally conductive fluidcontained within the fluid-tight containment vessel.
 18. Thesingle-phase immersion cooling method of claim 18, further comprising:generating at least a first flow channel for directing a first flow ofthe dielectric thermally conductive fluid contained within thefluid-tight containment vessel via the disposition of the first andsecond openings.
 19. The single-phase immersion cooling method of claim18, further comprising: providing at least a first conduit having athird modifiable portion comprising a third opening submerged within thedielectric thermally conductive fluid; and providing at least a secondconduit having a fourth modifiable portion comprising a fourth openingsubmerged within the dielectric thermally conductive fluid, dismountingthe first modifiable portion from the at least a first conduit andmounting the third modifiable portion to the at least a first conduit;dismounting the second modifiable portion from the at least a secondconduit and mounting the fourth modifiable portion to the at least asecond conduit; circulating, via the pump, dielectric thermallyconductive fluid from the heat exchanger outlet into the dielectricthermally conductive fluid contained within the fluid-tight containmentvessel through at least one of the first conduit or second conduit; andcirculating, via the pump, dielectric thermally conductive fluidcontained within the fluid-tight containment vessel thereout to the heatexchanger inlet through the other of the first conduit or secondconduit, generating at least a third flow channel for directing a thirdflow of the dielectric thermally conductive fluid contained within thefluid-tight containment vessel via the disposition of the third andfourth openings. wherein the third and fourth openings are disposed nearto greatest opposing ends of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel which are differentfrom that of the disposition of the first and second openings, wherebythe lengths and shapes of the first and third modifiable portions andlengths and shapes of the second and fourth modifiable portions aredifferent, respectively.
 20. The single-phase immersion cooling methodof claim 18, further comprising: providing at least a first conduithaving a fifth modifiable portion comprising a fifth opening submergedwithin the dielectric thermally conductive fluid; and providing at leasta second conduit having a fourth modifiable portion comprising a fourthopening submerged within the dielectric thermally conductive fluid,dismounting the first modifiable portion from the at least a firstconduit and mounting the fifth modifiable portion to the at least afirst conduit; dismounting the second modifiable portion from the atleast a second conduit and mounting the fourth modifiable portion to theat least a second conduit; circulating, via the pump, dielectricthermally conductive fluid from the heat exchanger outlet into thedielectric thermally conductive fluid contained within the fluid-tightcontainment vessel through at least one of the first conduit or secondconduit; and circulating, via the pump, dielectric thermally conductivefluid contained within the fluid-tight containment vessel thereout tothe heat exchanger inlet through the other of the first conduit orsecond conduit, generating at least a fifth flow channel for directing afifth flow of the dielectric thermally conductive fluid contained withinthe fluid-tight containment vessel via the disposition of the fifth andfourth openings. wherein the fifth and fourth openings are disposed nearto greatest opposing ends of the dielectric thermally conductive fluidcontained within the fluid-tight containment vessel which are differentfrom that of the disposition of the first and second openings, wherebythe lengths and shapes of the first and fifth modifiable portions andlengths and shapes of the second and fourth modifiable portions aredifferent, respectively.